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📅 September 25–26, 2026 📍 Hybrid (In-person + Online)
International Conference on Mechanical and Mechanics of Materials Organized by NERD Publication

Welcome to IC3M 2026

International Conference on Mechanical and Mechanics of Materials (IC3M 2026), organized by NERD Publication, is a premier platform for exploring advancements in this field. This hybrid (in-person + online) event takes place at IBIS Pune, Pune, Maharashtra, India, on September 25–26, 2026. IC3M 2026 brings together researchers, students, and professionals to share innovative ideas, discuss challenges, and shape the future of the field.

Who can attend

The conference is open to all, including undergraduate and postgraduate students, researchers, academics, and industry professionals interested in the conference's areas of focus.

About IC3M 2026

IC3M, organized by NERD Publication, is a premier platform for exploring advancements in mechanical engineering, materials engineering, smart manufacturing, and artificial intelligence applications — bringing together researchers, academicians, students, scientists, and industry professionals to share innovative ideas, discuss emerging challenges, and shape the future of mechanical engineering, advanced materials, and intelligent manufacturing systems.

IC3M 2026 is an acronym for International Conference on Mechanical and Mechanics of Materials.

Publication details

The IC3M 2026 conference proceedings are published with an ISBN in an open-access format, archived in the proceedings of NERD Publication.

Scope of IC3M 2026

IC3M 2026 welcomes submissions and discussions on a wide range of topics, including:

  • Manufacturing Processes
  • Machine Design and Vibration Analysis
  • Materials Engineering
  • Mechanics of Materials
  • Fluid Dynamics and Thermal Engineering
  • Robotics and Automation
  • Smart Manufacturing and Industry 4.0
  • Artificial Intelligence in Engineering
  • Digital Twin Technologies
  • Structural Health Monitoring
  • Renewable Energy Systems
  • Computational Engineering and Simulation
  • Other

See the full call for papers →